The assembly of our designed devices occurs in the following work processes:

• Acquisition of components
• Manufacturing of circuit boards (external)
• PCB assembly (semi-automatic and manual soldering)
• Programming and testing
• Assembly of the devices

When assembling the PCB, automated soldering processes, like reflow soldering, are applied. But when it comes to high standards we also rely on  manual soldering by experienced professionals. Therefore, the use of SMD in fine-pitch design down to 0.4 mm pitch is possible. New assembly techniques play an increasing role for modern component cases, like BGA (Ball Grid Array). The transition to lead-free soldering processes as part of the legislation to Restrict the use Of environmentally Hazardous Substances (RoHS) was a difficult challenge, which we have successfully and gladly risen to.

The picture below shows an example of an assembled RoHS-compliant Compact-PCI card with 8 layers and 100 µm resolution of the layout, designed at the customers order.